POLY/Solv RS-70 is a highly concentrated solution designed to economically and efficiently strip most commercially available, fully aqueous dry film resists. RS-70’s unique formulation contains penetrating additives designed to reduce entrapment of dry film in areas exhibiting tin or tin/lead over-plate. Additionally, RS-70 does not include sodium, potassium, ammonium hydroxide, or alcohols (including methanol); reducing alkaline attack of copper, tin, and solder. As such, RS-70 is easier to waste treat and exhibits less odor than many competitive products.
RS-70 was formulated to produce stripped resist particles averaging 0.2-0.5 cm in diameter (with most dry films), facilitating resist particulate filtration. RS-70 also incorporates a unique blend of inhibitor compounds to minimize corrosion of tin-lead and/or solder on hard boards and leave a bright, stable, oxide free copper surface suitable for AOI inspection.
