ENVIRO/Flow HAL-30 is a low to medium viscosity hot air solder leveling flux designed to assure rapid and complete soldering of printed wiring boards. ENVIRO/Flow Hall-30 is a low acid formulation minimizing equipment wear.
Performance Features
Removes copper oxides
Deposits a non-evaporative film over the copper resulting in a stable, clean solderable copper surface
Reduces the surface tension at the copper/solder interface resulting in excellent solder coverage and appearance free of solder tailings or solder webbing
Does not contain glycol ethers or activators which could attack solder mask or laminate
